ASE Global’s Post

Held at Resorts World Sentosa from 𝟮 𝘁𝗼 𝟱 𝗗𝗲𝗰, ASE Global and SPIL 矽品 are proud to sponsor the annual EPS - IEEE Electronics Packaging Society's Electronics Packaging Technology Conference (EPTC) #EPTC2025 conference — a global stage where #AdvancedPackaging innovation takes the spotlight. ✨ This year’s conference spotlighted the rapid evolution of semiconductor packaging, powered by the demands of #AI, high-performance computing #HPC, and system-level integration. Key takeaways include: 🔹 Pax Wang, Technology Development Director, United Microelectronics Corporation (UMC), shared insights on UMC’s latest breakthroughs in advanced packaging technologies — enabling higher performance and improved power efficiency for next-generation of edge #AI integration. 🔹 Loke Yuen WONG, Senior Director, Applied Materials, shared how materials innovation and scalable production technologies are unlocking the next chapter of advanced packaging manufacturing. 🔹 Dr. Harald Kuhn, Executive Director, Fraunhofer ENAS, explored how the industry is accelerating 𝘣𝘦𝘺𝘰𝘯𝘥 “𝘔𝘰𝘳𝘦 𝘔𝘰𝘰𝘳𝘦” 𝘵𝘰 “𝘔𝘰𝘳𝘦 𝘵𝘩𝘢𝘯 𝘔𝘰𝘰𝘳𝘦”, reshaping system architectures and advancing integration technologies. As a global leader in advanced packaging and heterogeneous integration, ASE Global remains committed to partnering with the global ecosystem — 𝘥𝘳𝘪𝘷𝘪𝘯𝘨 𝘪𝘯𝘯𝘰𝘷𝘢𝘵𝘪𝘰𝘯 𝘵𝘩𝘢𝘵 𝘤𝘰𝘯𝘯𝘦𝘤𝘵𝘴 𝘢𝘯𝘥 𝘱𝘰𝘸𝘦𝘳𝘴 𝘵𝘩𝘦 𝘧𝘶𝘵𝘶𝘳𝘦. Congratulations to Ranjan Rajoo and the entire EPTC Organising Committee for delivering an outstanding event! #ASE #EPTC2025 #AdvancedPackaging #HI #HPC