STATS ChipPAC joins imec's Automotive Chiplet Program to advance automotive electronics.

STATS ChipPAC is proud to be part of imec's Automotive Chiplet Program (#ACP), advancing the future of mobility alongside leading partners. As vehicles become increasingly software-defined and performance-driven, our commitment to scalable #chiplet architectures, advanced packaging, and reliable manufacturing supports the development of next-generation automotive electronics. With a proven track record in mass production, automotive system-in-package (SiP), and wafer-level packaging, STATS ChipPAC delivers solutions that enable smarter, safer, and more efficient vehicles—from ADAS and autonomous driving to immersive infotainment. Our global engineering teams ensure that advanced chiplet platforms are robust, flexible, and seamlessly integrated for the world’s most demanding automotive customers. Together with industry innovators, we’re accelerating the adoption of new technologies to keep tomorrow’s vehicles ahead of the curve. #Automotive #AdvancedPackaging #SDV #AutonomousDriving #FutureOfMobility

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